Area
Research Center for Microperipheric Technologies
Contact person: Dr.-Ing. Sibylle Dieckerhoff
Fraunhofer IZM
Activities
Modeling and thermal simulation with the software "Flomerics Flotherm" to characterize new packaging technologies for power semiconductor modules
Literature and market research about "Smart Power" modules in power electronics and the evaluation of that research
Technical preparation and graphical presentation of the results using MS Office software
Examples
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| CPES Embedded Power Module | Module with a wire bond |
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| CPES Embedded Power Module - Heat distribution | Module with a wire bond - Heat distribution |
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| CPES Embedded Power Module - Lateral cut | Power bridge circuit with two DCB's - Lateral cut |
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| Power bridge circuit | Power bridge circuit with Flex |
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| Power bridge circuit - Heat distribution | Metal Posts Interconnected Parallel Plate Structure - Lateral cut |